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<dc:title>A Dedicated Setup for Test and Evaluation of Surface Mounted Power Switches</dc:title>
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<dc:creator>Roig, Jaume</dc:creator>
<dc:creator>Vlachakis, Basil</dc:creator>
<dc:creator>Castro, Ignacio</dc:creator>
<dc:creator>Lamar, Diego G.</dc:creator>
<dc:creator>Declercq, Frederick</dc:creator>
<dc:creator>Bauwens, Filip</dc:creator>
<dc:subject>Superjunction</dc:subject>
<dc:subject>GaN</dc:subject>
<dc:subject>Surface mounted,</dc:subject>
<dc:subject>Superjunction</dc:subject>
<dcterms:abstract>This work reports the original design of a multipurpose setup for characterization and benchmark study of power switches packaged on QFN (Quad Flat No-leads). More specifically, the setup evaluates advanced 650 V GaN and Silicon power switches by using a 300W/200kHz CCM boost converter. A genuine daughter board has been optimized by experiment and finite-element simulation to provide low thermal impedance, setup/package compatibility and to be easy-of-use. Moreover, the setup is equipped to automatically extract power losses, as well as, voltage and current waveforms for device model calibration.</dcterms:abstract>
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<dc:title>A Dedicated Setup for Test and Evaluation of Surface Mounted Power Switches</dc:title>
<dc:creator>Fernandez, Manuel</dc:creator>
<dc:creator>Roig, Jaume</dc:creator>
<dc:creator>Vlachakis, Basil</dc:creator>
<dc:creator>Castro, Ignacio</dc:creator>
<dc:creator>Lamar, Diego G.</dc:creator>
<dc:creator>Declercq, Frederick</dc:creator>
<dc:creator>Bauwens, Filip</dc:creator>
<dc:subject>Superjunction</dc:subject>
<dc:subject>GaN</dc:subject>
<dc:subject>Surface mounted,</dc:subject>
<dc:subject>Superjunction</dc:subject>
<dc:description>This work reports the original design of a multipurpose setup for characterization and benchmark study of power switches packaged on QFN (Quad Flat No-leads). More specifically, the setup evaluates advanced 650 V GaN and Silicon power switches by using a 300W/200kHz CCM boost converter. A genuine daughter board has been optimized by experiment and finite-element simulation to provide low thermal impedance, setup/package compatibility and to be easy-of-use. Moreover, the setup is equipped to automatically extract power losses, as well as, voltage and current waveforms for device model calibration.</dc:description>
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